Advanced packaging (CoWoS)
Held by TSMC, ASE / SPIL, Amkor
What the record shows
- Nvidia reportedly holds more than half of TSMC's 2026 CoWoS capacity. TrendForce, 2026-08-05
- TSMC is reportedly outsourcing part of CoWoS to ASE; ASE and SPIL are adding their own lines with AMD's backing. TrendForce, 2026-08-05
- CoWoS and 3nm lead times run 52 to 78 weeks; 2nm runs 78 to 156 weeks. Silicon Analysts, 2026-06-16
Our read
The tightest gate in the stack. Whoever holds packaging allocation decides who ships AI chips in 2027, and today that is Nvidia. Custom-chip programs from Google, Amazon and Meta compete for the remainder. TSMC outsourcing part of the process tells you it cannot add capacity fast enough on its own.